Government Incentives |
12 Months Ended | ||||||||||||||||||||||||||||||||||||||||||
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Aug. 31, 2023 | |||||||||||||||||||||||||||||||||||||||||||
| Government Assistance [Abstract] | |||||||||||||||||||||||||||||||||||||||||||
| Government Incentives | Government Incentives We receive incentives from governmental entities primarily in India, Japan, Singapore, Taiwan, and the United States principally in the form of cash grants and tax credits. These incentives primarily relate to capital expenditures, have initial terms ranging from one year to 15 years, and may be subject to reimbursement if certain conditions are not met or maintained. The conditions attached to these incentives require us to incur expenditures related to the construction of new manufacturing facilities, the purchase and installation of specialized tools and equipment, R&D expenditures, and/or maintain certain levels of fixed asset investment or employee headcount during the incentive terms. The line items on the balance sheet affected by government incentives were as follows:
As of August 31, 2023, we had aggregate commitments from various governmental entities of up to $2 billion to be received through 2033 (in addition to the receivables and other noncurrent assets in the table above), subject to achievement of certain performance conditions. We also receive a 25% investment tax credit on qualified investments in U.S. semiconductor manufacturing under the CHIPS Act. Subsequent to August 31, 2023, we finalized an incentive arrangement under which we will receive additional grants of up to $1.3 billion. Government incentives related to capital expenditures have reduced by $1.57 billion as of August 31, 2023, of which $584 million pertained to 2023 expenditures. In 2023, benefited by $318 million (approximately 93% in COGS and 7% in R&D) from government incentives recognized as a reduction of expense, primarily in the form of reduced depreciation expense.
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